Patent Assignment
Reel/Frame 038011/0291
Assignment of Assignor's Interest
Recorded: 2016-03-17
Pages: 12
Assignors
KELLY, MICHAEL G.
Executed: 2014-01-17
HINER, DAVID JON
Executed: 2014-01-17
HUEMOELLER, RONALD
Executed: 2014-01-17
LEE, JI HUN
Executed: 2014-01-17
DO, WON CHUL
Executed: 2014-01-14
PARK, DOO HYUN
Executed: 2014-01-14
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Device Package Formed in a Chip-on-Wafer Last Process Using Thin Film Adhesives
Patent:
9,437,575 →
Application:
14/159,237 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →