Patent Assignment
Reel/Frame 038173/0498
Assignment of Assignor's Interest
Recorded: 2016-04-01
Pages: 3
Assignors
LEE, DONG-UK
Executed: 2016-03-29
KIM, YOUNG-GON
Executed: 2016-03-29
YOON, JIN-YOUNG
Executed: 2016-03-29
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, GYEONGGI-DO, SUWON-SI, 16674, KOREA, REPUBLIC OF
Covered Property
(1)
Package Substrate and Method of Manufacturing the Same