Patent Assignment
Reel/Frame 038441/0675
Assignment of Assignor's Interest
Recorded: 2016-05-03
Pages: 14
Assignors
HSU, CHIH-KAI
Executed: 2016-04-27
FU, SSU-I
Executed: 2016-04-27
HUNG, YU-HSIANG
Executed: 2016-04-27
CHENG, WEI-CHI
Executed: 2016-04-27
JENQ, JYH-SHYANG
Executed: 2016-04-27
YANG, TSUNG-MU
Executed: 2016-04-27
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device Having a Cap Layer with V-Shape
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.