Patent Assignment
Reel/Frame 038752/0595
Assignment of Assignor's Interest
Recorded: 2016-05-31
Pages: 3
Assignor
SKC CO., LTD.
Executed: 2016-05-25
Assignee
RION SMI, INC.
11, SANSU 2-GIL, BUGANG-MYEON, SEJONG-SI, KOREA, REPUBLIC OF
Covered Properties
(5)
Method for Fabricating Chemical Mechanical Polshing Pad Using Laser
Chemical Mechanical Polishing Pad Having Holes and or Grooves
Chemical Mechanical Polishing Pad Having Wave Shaped Grooves
Base Pad Polishing Pad and Multi-Layer Pad Comprising the Same
Polishing Pad Containing Interpenetrating Liquified Vinyl Monomer Network with Polyurethane Matrix Therein
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 11, 2002
From: PARK, INHA; KWON, TAE-KYOUNG; KIM, JAESEOK; HWANG, IN-JU
To: SKC CO., LTD.
Reel/Frame 012995/0463 →
Assignment of Assignor's Interest
May 3, 2002
From: PARK, INHA; KWON, TAE-KYOUNG; KIM, JAESEOK; HWANG, IN-JU
To: SKC CO., LTD.
Reel/Frame 013091/0923 →
Assignment of Assignor's Interest
Apr 11, 2003
From: PARK, INHA; KWON, TAE-KYOUNG; KIM, JAESEOK
To: SKC CO., LTD.
Reel/Frame 014232/0121 →
Assignment of Assignor's Interest
Nov 16, 2006
From: SONG, EU-GENE; LEE, JU-YEOL; KIM, SUNG-MIN; KIM, JAE-SEOK
To: SKC CO., LTD.
Reel/Frame 018619/0310 →
Assignment of Assignor's Interest
Jan 22, 2008
From: PARK, IN-HA; LEE, JU-YEOL; JUN, SUNG-MIN
To: SKC CO., LTD.
Reel/Frame 020446/0591 →