Patent Assignment
Reel/Frame 038882/0965
Assignment of Assignor's Interest
Recorded: 2016-06-03
Pages: 3
Assignors
BANG, WON BAE
Executed: 2016-04-19
KIM, BYONG JIN
Executed: 2016-05-09
KIM, GI JEONG
Executed: 2016-05-10
CHUNG, JI YOUNG
Executed: 2016-05-10
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Method for Fabricating Semiconductor Package Having a Multi-Layer Encapsulated Conductive Substrate and Structure
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.