IP Library › Assignment 039132/0238
Patent Assignment
Reel/Frame 039132/0238

Assignment of Assignor's Interest

Recorded: 2016-07-12 Pages: 3
Assignors
LEE, HSIN-YI
Executed: 2016-05-24
TSAI, CHENG-YEN
Executed: 2016-05-24
LEE, DA-YUAN
Executed: 2016-05-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Atomic Layer Deposition Methods and Structures Thereof
Patent: 9,972,694 →
Application: 15/178,150 →
Publication: US 2017/0110552
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 29, 2016
From: LEE, HSIN-YI; TSAI, CHENG-YEN; LEE, DA-YUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 039295/0929 →
Assignment of Assignor's Interest Aug 16, 2016
From: LEE, HSIN-YI; TSAI, CHENG-YEN; LEE, DA-YUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 039458/0257 →
Corrective Assignment to Correct the the Name of the Receiving Party Data from Taiwan Semiconductor Manufacturing Company, Ltd. Previously Recorded on Reel 039295 Frame 0929. Assignor(S) Hereby Confirms the Receiving Party Data Name Be Changed to Taiwan Semiconductor Manufacturing Co., Ltd.. Sep 20, 2016
From: LEE, HSIN-YI; TSAI, CHENG-YEN; LEE, DA-YUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 040092/0733 →