Patent Assignment
Reel/Frame 040092/0733
Corrective Assignment to Correct the the Name of the Receiving Party Data from Taiwan Semiconductor Manufacturing Company, Ltd. Previously Recorded on Reel 039295 Frame 0929. Assignor(S) Hereby Confirms the Receiving Party Data Name Be Changed to Taiwan Semiconductor Manufacturing Co., Ltd..
Recorded: 2016-09-20
Pages: 4
Assignors
LEE, HSIN-YI
Executed: 2016-05-24
TSAI, CHENG-YEN
Executed: 2016-05-24
LEE, DA-YUAN
Executed: 2016-05-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6,, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Atomic Layer Deposition Methods and Structures Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 12, 2016
From: LEE, HSIN-YI; TSAI, CHENG-YEN; LEE, DA-YUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 039132/0238 →
Assignment of Assignor's Interest
Jul 29, 2016
From: LEE, HSIN-YI; TSAI, CHENG-YEN; LEE, DA-YUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 039295/0929 →
Assignment of Assignor's Interest
Aug 16, 2016
From: LEE, HSIN-YI; TSAI, CHENG-YEN; LEE, DA-YUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 039458/0257 →