IP Library › Assignment 039458/0257
Patent Assignment
Reel/Frame 039458/0257

Assignment of Assignor's Interest

Recorded: 2016-08-16 Pages: 3
Assignors
LEE, HSIN-YI
Executed: 2016-05-24
TSAI, CHENG-YEN
Executed: 2016-05-24
LEE, DA-YUAN
Executed: 2016-05-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6,, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Atomic Layer Deposition Methods and Structures Thereof
Patent: 9,972,694 →
Application: 15/178,150 →
Publication: US 2017/0110552
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 12, 2016
From: LEE, HSIN-YI; TSAI, CHENG-YEN; LEE, DA-YUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 039132/0238 →
Assignment of Assignor's Interest Jul 29, 2016
From: LEE, HSIN-YI; TSAI, CHENG-YEN; LEE, DA-YUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 039295/0929 →
Corrective Assignment to Correct the the Name of the Receiving Party Data from Taiwan Semiconductor Manufacturing Company, Ltd. Previously Recorded on Reel 039295 Frame 0929. Assignor(S) Hereby Confirms the Receiving Party Data Name Be Changed to Taiwan Semiconductor Manufacturing Co., Ltd.. Sep 20, 2016
From: LEE, HSIN-YI; TSAI, CHENG-YEN; LEE, DA-YUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 040092/0733 →