IP Library › Assignment 039397/0578
Patent Assignment
Reel/Frame 039397/0578

Assignment of Assignor's Interest

Recorded: 2016-08-10 Pages: 3
Assignor
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-8980, JAPAN
Covered Property (1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Method of Cleaning Processing Vessel
Patent: 8,679,259 →
Application: 13/089,988 →
Publication: US 2011/0259370
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 29, 2011
From: KAMEDA, KENJI
To: HITACHI KOKUSAI ELECTRIC INC.; L'AIR LIQUIDE SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE
Reel/Frame 026523/0375 →
Assignment of Assignor's Interest Jun 29, 2011
From: SONOBE, JUN; TADAKI, YUDAI
To: HITACHI KOKUSAI ELECTRIC INC.; L'AIR LIQUIDE SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE
Reel/Frame 026523/0546 →
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →