Assignment of Assignor's Interest

Recorded: 2016-08-15 Pages: 7

Assignors

LEE, SEUNG WOO

Executed: 2016-08-11

KIM, BYONG JIN

Executed: 2016-08-11

BANG, WON BAE

Executed: 2016-08-11

KANG, SANG GOO

Executed: 2016-08-11

Assignee

AMKOR TECHNOLOGY, INC.

2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284

Covered Property (1)

Method for Fabricating Semiconductor Package and Semiconductor Package Using the Same

Patent: 9,613,829 →

Application: 15/148,895 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.