IP Library Assignment 039457/0263
Patent Assignment
Reel/Frame 039457/0263

Assignment of Assignor's Interest

Recorded: 2016-08-16 Pages: 3
Assignors
WANG, ZHIYONG
Executed: 2016-08-09
WANG, DEJIN
Executed: 2016-08-09
MA, JINGJING
Executed: 2016-08-09
Assignee
CSMC TECHNOLOGIES FAB1 CO., LTD.
NO. 8 XINZHOU ROAD, WUXI NEW DISTRICT, JIANGSU, 214028, CHINA
Covered Property (1)
Silicon-On-Insulator Device and Intermetallic Dielectric Layer Structure Thereof and Manufacturing Method
Application: 15/119,289 →
Publication: US 2017/0011957
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Apr 29, 2019
From: CSMC TECHNOLOGIES FAB1 CO., LTD.
To: CSMC TECHNOLOGIES FAB2 CO., LTD.
Reel/Frame 049023/0619 →