IP Library › Assignment 049023/0619
Patent Assignment
Reel/Frame 049023/0619

Merger

Recorded: 2019-04-29 Pages: 4
Assignor
CSMC TECHNOLOGIES FAB1 CO., LTD.
Executed: 2017-05-27
Assignee
CSMC TECHNOLOGIES FAB2 CO., LTD.
NO.8 XINZHOU ROAD, WUXI NEW DISTRICT, JIANGSU, 214028, CHINA
Covered Property (1)
Silicon-On-Insulator Device and Intermetallic Dielectric Layer Structure Thereof and Manufacturing Method
Application: 15/119,289 →
Publication: US 2017/0011957
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 16, 2016
From: WANG, ZHIYONG; WANG, DEJIN; MA, JINGJING
To: CSMC TECHNOLOGIES FAB1 CO., LTD.
Reel/Frame 039457/0263 →