Patent Assignment
Reel/Frame 039468/0945
Assignment of Assignor's Interest
Recorded: 2016-08-17
Pages: 8
Assignors
JEONG, JIN SUK
Executed: 2016-07-21
SEONG, KYEONG SOOL
Executed: 2016-07-21
KIM, KYE RYUNG
Executed: 2016-07-21
KWON, YOUNG IK
Executed: 2016-07-21
SIM, KI DONG
Executed: 2016-07-21
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Method of Forming a Semiconductor Device Including Forming an Electromagnetic Interference (Emi) Shield Layer Over an Encapsulated Die on an Adhesive Tape
Application:
15/149,378 →
Publication:
US 2017/0141046
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.