SEMICONDUCTOR DEVICE WITH AN ELECTROMAGNETIC INTERFERENCE (EMI) SHIELD
A method for forming a semiconductor device with an electromagnetic interference shield is disclosed and may include coupling a semiconductor die to a first surface of a substrate, encapsulating the semiconductor die and portions of the substrate using an encapsulant, placing the encapsulated substrate and semiconductor die on an adhesive tape, and forming an electromagnetic interference (EMI) shield layer on the encapsulant, on side surfaces of the substrate, and on portions of the adhesive tape adjacent to the encapsulated substrate and semiconductor die. The adhesive tape may be peeled away from the encapsulated substrate and semiconductor die, thereby leaving portions of the EMI shield layer on the encapsulant and on the side surfaces of the substrate with other portions of the EMI shield layer remaining on portions of the adhesive tape. Contacts may be formed on a second surface of the substrate opposite to the first surface of the substrate.
1 . A method of forming a semiconductor device, the method comprising:
coupling a semiconductor die to a first surface of a substrate;
encapsulating the semiconductor die and portions of the first surface of the substrate using an encapsulant;
placing the encapsulated substrate and semiconductor die on an adhesive tape;
forming an electromagnetic interference (EMI) shield layer on the encapsulant, on side surfaces of the substrate, and on portions of the adhesive tape adjacent to the encapsulated substrate and semiconductor die;
peeling away the adhesive tape from the encapsulated substrate and semiconductor die, thereby leaving portions of the EMI shield layer on the encapsulant and on the side surfaces of the substrate with other portions of the EMI shield layer remaining on portions of the adhesive tape that were adjacent to the encapsulated substrate and semiconductor die.
2 . The method according to claim 1 , comprising forming contacts on a second surface of the substrate opposite to the first surface of the substrate.
3 . The method according to claim 2 , wherein the contacts comprise conductive bumps.
4 . The method according to claim 2 , wherein the contacts comprise conductive lands.
5 . The method according to claim 2 , comprising placing an adhesive layer on the contacts and the second surface of the substrate, such that the contacts are encapsulated by the adhesive layer.
6 . The method according to claim 5 , wherein the adhesive layer is removed in the peeling away of the adhesive tape.
7 . The method according to claim 1 , wherein the EMI shield layer comprises one or more of: silver, copper, aluminum, nickel, palladium, and/or chromium.
8 . The method according to claim 1 , wherein the EMI shield layer is coupled to a ground circuit pattern of the substrate.
9 . A semiconductor device comprising:
a substrate comprising a first surface and a second surface opposite to the first surface;
a semiconductor die coupled to the first surface of the substrate;
an encapsulant encapsulating the semiconductor die and portions of the first surface of the substrate; and
an electromagnetic interference (EMI) shield layer on the encapsulant and side surfaces of the substrate between the first and second surfaces.
10 . The semiconductor device according to claim 9 , comprising contacts on the second surface of the substrate.
11 . The semiconductor device according to claim 10 , wherein the contacts comprise conductive bumps.
12 . The semiconductor device according to claim 10 , wherein the contacts comprise conductive lands.
13 . The semiconductor device according to claim 9 , wherein the EMI shield layer comprises one or more of: silver, copper, aluminum, nickel, palladium, and/or chromium.
14 . The semiconductor device according to claim 9 , wherein the EMI shield layer is coupled to a ground circuit pattern of the substrate.
15 . A method of fabricating a semiconductor device, the method comprising:
coupling a semiconductor die to a first surface of a substrate;
encapsulating the semiconductor die and portions of the first surface of the substrate using an encapsulant;
coupling electrical contacts to a second surface of the substrate opposite to the first surface of the substrate;
placing an adhesive layer on the second surface of the substrate such that the adhesive layer surrounds the electrical contacts;
placing the encapsulated substrate and semiconductor die on an adhesive tape;
forming an electromagnetic interference (EMI) shield layer on the encapsulant, on side surfaces of the substrate, and on portions of the adhesive tape adjacent to the encapsulated substrate and semiconductor die; and
peeling away the adhesive tape and the adhesive layer from the encapsulated substrate and semiconductor die, thereby leaving portions of the EMI shield layer on the encapsulant and on the side surfaces of the substrate with other portions of the EMI shield layer remaining on portions of the adhesive tape that were adjacent to the encapsulated substrate and semiconductor die.
16 . The method according to claim 15 , wherein the electrical contacts comprise conductive bumps.
17 . The method according to claim 15 , wherein the electrical contacts comprise conductive lands.
18 . The method according to claim 15 , wherein the EMI shield layer comprises one or more of silver, copper, aluminum, nickel, palladium, and chromium.
19 . The method according to claim 15 , wherein the EMI shield layer is coupled to a ground circuit pattern of the substrate.
20 . The method according to claim 15 , wherein the adhesive layer comprises a heat resistant base film comprising one or more of: polyimide (PI), polyethylene naphthalate (PEN), and/or a silicone-based adhesive layer.