Patent Assignment
Reel/Frame 040172/0470
Assignment of Assignor's Interest
Recorded: 2016-10-31
Pages: 4
Assignor
CHEN, YI-HO
Executed: 2016-08-18
Assignee
QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE, QINHUANGDAO, CHINA
Covered Property
(1)
Package Substrate, Method for Making the Same, and Package Structure Having the Same
Patent:
9,735,097 →
Application:
15/338,548 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Sep 18, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.
Reel/Frame 064929/0589 →
Assignment of Assignor's Interest
Sep 21, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.
Reel/Frame 064990/0582 →