Patent Assignment
Reel/Frame 064929/0589
Change of Name
Recorded: 2023-09-18
Pages: 3
Assignor
QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
Executed: 2023-08-01
Assignee
LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18-2 TENGFEI ROAD,ECONOMY AND TECHNOLOGY DEVELOPMENT ZONE, QINHUANGDAO, CHINA
Covered Property
(1)
Package Substrate, Method for Making the Same, and Package Structure Having the Same
Patent:
9,735,097 →
Application:
15/338,548 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 31, 2016
From: CHEN, YI-HO
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
Reel/Frame 040172/0470 →
Assignment of Assignor's Interest
Sep 21, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.
Reel/Frame 064990/0582 →