IP Library › Assignment 064990/0582
Patent Assignment
Reel/Frame 064990/0582

Assignment of Assignor's Interest

Recorded: 2023-09-21 Pages: 3
Assignor
Assignee
LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18-2 TENGFEI ROAD,ECONOMY AND TECHNOLOGY DEVELOPMENT ZONE, QINHUANGDAO, CHINA
Covered Property (1)
Package Substrate, Method for Making the Same, and Package Structure Having the Same
Patent: 9,735,097 →
Application: 15/338,548 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 31, 2016
From: CHEN, YI-HO
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
Reel/Frame 040172/0470 →
Change of Name Sep 18, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.
Reel/Frame 064929/0589 →