Patent Assignment
Reel/Frame 040695/0453
Change of Address of the Assignee
Recorded: 2016-11-21
Pages: 13
Assignor
FUJITSU SEMICONDUCTOR LIMITED
Executed: 2015-03-03
Assignee
FUJITSU SEMICONDUCTOR LIMITED
2-100-45 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Properties
(3)
Interconnect Structure for Stacked Semiconductor Device
Patent:
6,465,892 →
Application:
09/548,916 →
Method for Manufacturing an Interconnect Structure for Stacked Semiconductor Device
Semiconductor Device and Its Manufacturing Method
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
Assignment of Assignor's Interest
Oct 20, 2014
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 033984/0371 →
Assignment of Assignor's Interest
Mar 25, 2015
From: HITACHI, LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 035249/0082 →
Assignment of Assignor's Interest
May 30, 2017
From: FUJITSU SEMICONDUCTOR LIMITED
To: SONY CORPORATION
Reel/Frame 042612/0158 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →