IP Library Assignment 033984/0371
Patent Assignment
Reel/Frame 033984/0371

Assignment of Assignor's Interest

Recorded: 2014-10-20 Pages: 4
Assignor
MITSUBISHI DENKI KABUSHIKI KAISHA
Executed: 2014-09-29
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties (17)
Phase-Shifting Photomask Blank and Method of Manufacturing the Same as Well as Phase-Shifting Photomask
Patent: 5,952,128 →
Application: 08/633,338 →
Phase-Shifting Photomask Blank and Method of Manufacturing the Same as Well as Phase-Shifting Photomask
Patent: 5,938,897 →
Application: 08/876,906 →
Bonded Semiconductor Integrated Circuit Device
Patent: 5,923,091 →
Application: 08/917,342 →
Phase-Shifting Photomask Blank, Phase-Shifting Photomask, Method for Producing Them and Apparatus for Manufacturing the Blank
Patent: 6,228,541 →
Application: 09/292,936 →
Interconnect Structure for Stacked Semiconductor Device
Patent: 6,465,892 →
Application: 09/548,916 →
Method of Manufacturing a Semiconductor Device Including a Fuse
Patent: 6,518,158 →
Application: 09/699,463 →
Phase-Shift Photo Mask Blank, Phase-Shift Photo Mask and Method for Fabricating Semiconductor Devices
Patent: 6,569,577 →
Application: 09/704,697 →
Driver Circuit, Receiver Circuit, and Signal Transmission Bus System
Patent: 6,670,830 →
Application: 09/761,583 →
Publication: US 2001/0013075
Soi Substrate, Method of Manufacture Thereof, and Semiconductor Device Using Soi Substrate
Patent: 6,558,990 →
Application: 09/786,228 →
Semiconductor Integrated Circuit Device Allowing Accurate Evaluation of Access Time of Memory Core Contained Therein and Access Time Evaluating Method
Patent: 6,512,707 →
Application: 09/837,164 →
Publication: US 2001/0055226
Semiconductor Memory Device Having Configuration Suited for High Integration
Patent: 6,545,934 →
Application: 09/840,175 →
Publication: US 2002/0034116
A Semiconductor Intergrated Circuit Having Switching Transistors and Varactors
Patent: 6,731,153 →
Application: 09/963,500 →
Publication: US 2002/0044012
Semiconductor Device and Manufacturing Method Thereof
Patent: 6,506,651 →
Application: 09/986,581 →
Publication: US 2002/0047163
Method for Manufacturing an Interconnect Structure for Stacked Semiconductor Device
Patent: 6,472,293 →
Application: 09/997,878 →
Publication: US 2002/0074670
Method and Apparatus for Dry-Etching Half-Tone Phase-Shift Films, Half-Tone Phase-Shift Photomasks and Method for the Preparation Thereof, and Semiconductor Circuits and Method for the Fabrication Thereof
Patent: 7,063,922 →
Application: 10/706,971 →
Publication: US 2004/0101767
Method and Apparatus for Dry-Etching Half-Tone Phase-Shift Films, Half-Tone Phase-Shift Photomasks and Method for the Preparation Thereof, and Semiconductor Circuits and Method for the Fabrication Thereof
Patent: 7,001,698 →
Application: 10/712,032 →
Publication: US 2005/0011862
Electronic Circuit Device
Patent: 6,961,229 →
Application: 10/781,942 →
Publication: US 2004/0207432
Related Assignments (10)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
Assignment of Assignor's Interest Mar 25, 2015
From: HITACHI, LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 035249/0082 →
Change of Address of the Assignee Nov 21, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 040695/0453 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Change of Name Mar 18, 2020
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 052184/0943 →
Patent Security Agreement Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
Release of Security Interest in Patents Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
Reel/Frame 053654/0254 →
Corrective Assignment to Correct the Assignor Name Previously Recorded on Reel 052853 Frame 0153. Assignor(S) Hereby Confirms the Patent Security Agreement. Mar 2, 2021
From: ACACIA RESEARCH GROUP LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 056775/0066 →
Assignment of Assignor's Interest Mar 5, 2021
From: PANASONIC CORPORATION
To: NUVOTON TECHNOLOGY CORPORATION JAPAN
Reel/Frame 055502/0185 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 053654 Frame: 0254. Assignor(S) Hereby Confirms the Assignment. Jun 10, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 057454/0045 →