Patent Assignment
Reel/Frame 041167/0601
Assignment of Assignor's Interest
Recorded: 2017-02-03
Pages: 7
Assignors
KURIMOTO, KOUHEI
Executed: 2016-11-29
KISHIDA, KAZUHITO
Executed: 2016-12-02
KAYANO, RINZO
Executed: 2016-11-29
MIZUNO, JUN
Executed: 2016-11-29
KAKIO, SHOJI
Executed: 2016-12-01
Assignees
THE JAPAN STEEL WORKS, LTD.
11-1, OSAKI 1-CHOME, SHINAGAWA-KU, TOKYO, 141-0032, JAPAN
WASEDA UNIVERSITY
104 TOTSUKAMACHI 1-CHOME, SHINJUKU-KU, TOKYO, 169-8050, JAPAN
UNIVERSITY OF YAMANASHI
4-4-37, TAKEDA, KOFU-SHI, YAMANASHI, 400-8510, JAPAN
Covered Property
(1)
Bonded Substrate, Surface Acoustic Wave Element, Surface Acoustic Wave Device, and Method of Manufacturing Bonded Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.