IP Library › Assignment 051541/0271
Patent Assignment
Reel/Frame 051541/0271

Assignment of Assignor's Interest

Recorded: 2020-01-06 Pages: 4
Assignors
UNIVERSITY OF YAMANASHI
Executed: 2019-10-01
WASEDA UNIVERSITY
Executed: 2019-10-01
Assignee
THE JAPAN STEEL WORKS, LTD.
11-1, OSAKI 1-CHOME SHINAGAWA-KU,, TOKYO, 141-0032, JAPAN
Covered Property (1)
Bonded Substrate, Surface Acoustic Wave Element, Surface Acoustic Wave Device, and Method of Manufacturing Bonded Substrate
Application: 15/423,979 →
Publication: US 2018/0048282
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 3, 2017
From: KURIMOTO, KOUHEI; KISHIDA, KAZUHITO; KAYANO, RINZO; MIZUNO, JUN
To: THE JAPAN STEEL WORKS, LTD.; WASEDA UNIVERSITY; UNIVERSITY OF YAMANASHI
Reel/Frame 041167/0601 →