Patent Assignment
Reel/Frame 041336/0083
Assignment of Assignor's Interest
Recorded: 2017-02-22
Pages: 6
Assignors
DONOFRIO, MATTHEW
Executed: 2007-12-10
SLATER, DAVID B., JR.
Executed: 2007-11-12
EDMOND, JOHN A.
Executed: 2008-02-18
KONG, HUA SHUANG
Executed: 2008-01-04
Assignee
CREE, INC.
4600 SILICON DRIVE, DURHAM, NORTH CAROLINA, 27703
Covered Property
(1)
Nickel Tin Bonding System with Barrier Layer for Semiconductor Wafers and Devices
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 7, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 055911/0577 →
Security Interest
Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Patent Security Interest Recorded at R/F 058983/0001
Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Patent Security Agreement
Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →