Patent Assignment
Reel/Frame 055911/0577
Assignment of Assignor's Interest
Recorded: 2021-04-07
Pages: 240
Assignor
CREE, INC.
Executed: 2021-03-01
Assignee
CREELED, INC.
39870 EUREKA DRIVE, NEWARK, CALIFORNIA, 94560
Covered Properties
(19)
Methods of Forming Semiconductor Devices Having Self Aligned Semiconductor Mesas and Contact Layers
Nickel Tin Bonding System for Semiconductor Wafers and Devices
Semiconductor Devices Having Self Aligned Semiconductor Mesas and Contact Layers
Integrated Heat Spreaders for Light Emitting Devices (Leds) and Related Assemblies
Led Lighting Units and Assemblies with Edge Connectors
Reflective Mounting Substrates For Light Emitting Diodes
Light Emitting Devices Having Current Reducing Structures and Methods of Forming Light Emitting Devices Having Current Reducing Structures
Semiconductor Light Emitting Device Packages and Methods
Nickel Tin Bonding System with Barrier Layer for Semiconductor Wafers and Devices
Led Lighting Units and Assemblies with Edge Connectors
Systems and Methods for Application of Optical Materials to Optical Elements
Methods of Forming Light Emitting Devices Having Current Reducing Structures
Light Emitting Diode (Led) Arrays Including Direct Die Attach and Related Assemblies
Nickel Tin Bonding System with Barrier Layer for Semiconductor Wafers and Devices
Semiconductor Light Emitting Device Packages and Methods
Methods of Forming Light Emitting Devices Having Current Reducing Structures
Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies
Light Emitting Diode (Led) Arrays Including Direct Die Attach and Related Assemblies
Light Emitting Devices Having Current Reducing Structures
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 29, 2012
From: DONOFRIO, MATTHEW; HUSSELL, CHRISTOPHER P.; EDMOND, JOHN ADAM
To: CREE, INC.
Reel/Frame 028866/0542 →
Assignment of Assignor's Interest
Feb 22, 2017
From: EMERSON, DAVID TODD; HABERERN, KEVIN; BERGMANN, MICHAEL JOHN; SLATER, DAVID B., JR.
To: CREE, INC.
Reel/Frame 041333/0788 →
Assignment of Assignor's Interest
Feb 22, 2017
From: ROBERTS, JOHN K.; SIMS, PAUL E.
To: CREE, INC.
Reel/Frame 041333/0902 →
Assignment of Assignor's Interest
Feb 22, 2017
From: LOH, BAN P.; CANNON, NATHANIEL O.; HILLER, NORBERT; EDMOND, JOHN
To: CREE, INC.
Reel/Frame 041335/0898 →
Assignment of Assignor's Interest
Feb 22, 2017
From: DONOFRIO, MATTHEW; SLATER, DAVID B., JR.; EDMOND, JOHN A.; KONG, HUA SHUANG
To: CREE, INC.
Reel/Frame 041336/0083 →
Assignment of Assignor's Interest
Feb 22, 2017
From: HAERERN, KEVIN WARD; ROSADO, RAYMOND; BERGMAN, MICHAEL JOHN; EMERSON, DAVID TODD
To: CREE, INC.
Reel/Frame 041332/0868 →
Security Interest
Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Patent Security Interest Recorded at R/F 058983/0001
Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Patent Security Agreement
Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →