Patent Assignment
Reel/Frame 041391/0643
Assignment of Assignor's Interest
Recorded: 2017-02-28
Pages: 8
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.