IP Library › Assignment 041391/0677
Patent Assignment
Reel/Frame 041391/0677

Assignment of Assignor's Interest

Recorded: 2017-02-28 Pages: 8
Assignors
BYUN, SE-GI
Executed: 2016-11-07
YU, JIN
Executed: 2016-11-07
Assignee
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
291, DAEHAK-RO, YUSEONG-GU, DAEJEON-SI, 34141, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package and Method of Manufacturing the Same
Application: 15/443,347 →
Publication: US 2017/0246699
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 28, 2017
From: SONG, MIN-WOO; CHO, SUNG-IL
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 041391/0643 →