Patent Assignment
Reel/Frame 041481/0316
Assignment of Assignor's Interest
Recorded: 2017-01-25
Pages: 23
Assignors
CHUNG, WON WOONG
Executed: 2016-12-09
HWANG, SUN HYE
Executed: 2016-12-17
CHO, YOUN JOUNG
Executed: 2016-12-09
CHOI, JUNG SIK
Executed: 2016-12-12
ZHOU, XIAOBING
Executed: 2016-12-01
REKKEN, BRIAN DAVID
Executed: 2016-12-01
HWANG, BYUNG KEUN
Executed: 2016-12-01
TELGENHOFF, MICHAEL DAVID
Executed: 2016-12-01
Assignees
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
DOW CORNING CORPORATION
2200 WEST SALZBURG ROAD, P.O. BOX 994, MIDLAND, MICHIGAN, 48686-0994
Covered Property
(1)
Method for Fabricating Semiconductor Device Including Forming a Dielectric Layer on a Structure Having a Height Difference Using Ald
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 13, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045188/0885 →
Assignment of Assignor's Interest
Aug 31, 2020
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 053644/0918 →
Assignment of Assignor's Interest
Jan 27, 2021
From: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
To: JIANGSU NATA OPTO-ELECTRONIC MATERIALS CO. LTD.
Reel/Frame 055054/0570 →
Assignment of Assignor's Interest
Jun 21, 2021
From: JIANGSU NATA OPTO-ELECTRONIC MATERIALS CO. LTD.
To: NATA SEMICONDUCTOR MATERIALS CO., LTD.
Reel/Frame 056610/0391 →