Patent Assignment
Reel/Frame 053644/0918
Assignment of Assignor's Interest
Recorded: 2020-08-31
Pages: 9
Assignor
DOW SILICONES CORPORATION
Executed: 2019-08-23
Assignee
DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
974 CENTRE ROAD, WILMINGTON, DELAWARE, 19805
Covered Property
(1)
Method for Fabricating Semiconductor Device Including Forming a Dielectric Layer on a Structure Having a Height Difference Using Ald
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 25, 2017
From: CHUNG, WON WOONG; HWANG, SUN HYE; CHO, YOUN JOUNG; CHOI, JUNG SIK
To: SAMSUNG ELECTRONICS CO., LTD.; DOW CORNING CORPORATION
Reel/Frame 041481/0316 →
Change of Name
Mar 13, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045188/0885 →
Assignment of Assignor's Interest
Jan 27, 2021
From: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
To: JIANGSU NATA OPTO-ELECTRONIC MATERIALS CO. LTD.
Reel/Frame 055054/0570 →
Assignment of Assignor's Interest
Jun 21, 2021
From: JIANGSU NATA OPTO-ELECTRONIC MATERIALS CO. LTD.
To: NATA SEMICONDUCTOR MATERIALS CO., LTD.
Reel/Frame 056610/0391 →