Patent Assignment
Reel/Frame 045188/0885
Change of Name
Recorded: 2018-03-13
Pages: 5
Assignor
DOW CORNING CORPORATION
Executed: 2018-02-01
Assignee
DOW SILICONES CORPORATION
2040 DOW CENTER, INTELLECTUAL PROPERTY, G-1649, 2211 H.H. DOW WAY, MIDLAND, MICHIGAN, 48674
Covered Property
(1)
Method for Fabricating Semiconductor Device Including Forming a Dielectric Layer on a Structure Having a Height Difference Using Ald
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 25, 2017
From: CHUNG, WON WOONG; HWANG, SUN HYE; CHO, YOUN JOUNG; CHOI, JUNG SIK
To: SAMSUNG ELECTRONICS CO., LTD.; DOW CORNING CORPORATION
Reel/Frame 041481/0316 →
Assignment of Assignor's Interest
Aug 31, 2020
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 053644/0918 →
Assignment of Assignor's Interest
Jan 27, 2021
From: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
To: JIANGSU NATA OPTO-ELECTRONIC MATERIALS CO. LTD.
Reel/Frame 055054/0570 →
Assignment of Assignor's Interest
Jun 21, 2021
From: JIANGSU NATA OPTO-ELECTRONIC MATERIALS CO. LTD.
To: NATA SEMICONDUCTOR MATERIALS CO., LTD.
Reel/Frame 056610/0391 →