IP Library › Assignment 056610/0391
Patent Assignment
Reel/Frame 056610/0391

Assignment of Assignor's Interest

Recorded: 2021-06-21 Pages: 8
Assignor
Assignee
NATA SEMICONDUCTOR MATERIALS CO., LTD.
117 XINCHENG AVENUE, SHITAN INDUSTRIAL PARK, SHIZI TOWN, QUANJIAO COUNTY, CHUZHOU CITY, CHINA
Covered Properties (11)
Composition Comprising Neopentasilane and Method of Preparing Same
Patent: 8,147,789 →
Application: 12/440,299 →
Publication: US 2010/0176338
Method of making 2,2,4,4-Tetrasilylpentasilane
Patent: 9,926,203 →
Application: 14/915,404 →
Publication: US 2016/0207784
Silicon Precursor, Method of Forming a Layer Using the Same, and Method of Fabricating Semiconductor Device Using the Same
Patent: 9,899,392 →
Application: 15/223,685 →
Publication: US 2016/0336328
Process Of Synthesizing Diisopropylamino-Disilanes
Patent: 9,840,523 →
Application: 15/300,987 →
Publication: US 2017/0029446
Diaminosilane Compounds
Application: 15/314,300 →
Publication: US 2017/0129908
Monoaminosilane Compounds
Application: 15/314,323 →
Publication: US 2017/0114081
Method for Fabricating Semiconductor Device Including Forming a Dielectric Layer on a Structure Having a Height Difference Using Ald
Application: 15/414,913 →
Publication: US 2018/0211842
Pentachlorodisilane
Application: 15/558,726 →
Publication: US 2018/0076025
Synthesis of Disilanylamines through Transamination
Application: 15/779,653 →
Publication: US 2018/0258107
Method for Making an Organoaminosilane; a Method for Making a Silylamine from the Organoaminosilane
Application: 16/061,461 →
Publication: US 2019/0352315
Catalysis of Dehydrocoupling Reactions Between Amines and Silanes
Application: 16/340,431 →
Publication: US 2019/0308996
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 25, 2017
From: CHUNG, WON WOONG; HWANG, SUN HYE; CHO, YOUN JOUNG; CHOI, JUNG SIK
To: SAMSUNG ELECTRONICS CO., LTD.; DOW CORNING CORPORATION
Reel/Frame 041481/0316 →
Change of Name Feb 27, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045460/0278 →
Change of Name Feb 28, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045470/0188 →
Change of Name Mar 13, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045188/0885 →
Change of Name Mar 29, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045381/0992 →
Assignment of Assignor's Interest Apr 13, 2020
From: REKKEN, BRIAN D.
To: DOW CORNING CORPORATION
Reel/Frame 052376/0500 →
Assignment of Assignor's Interest Aug 11, 2020
From: REKKEN, BRIAN D.
To: DOW CORNING CORPORATION
Reel/Frame 053457/0081 →
Assignment of Assignor's Interest Aug 13, 2020
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 053486/0256 →
Change of Name Aug 21, 2020
From: DOW COMING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 053559/0810 →
Assignment of Assignor's Interest Aug 31, 2020
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 053645/0134 →
Assignment of Assignor's Interest Aug 31, 2020
From: KETOLA, BARRY M.; MADDOCK, JESSE A.; REKKEN, BRIAN D.; TELGENHOFF, MICHAEL D.
To: DOW SILICONES CORPORATION
Reel/Frame 053644/0541 →
Assignment of Assignor's Interest Aug 31, 2020
From: ZHOU, XIAOBING
To: DOW CORNING CORPORATION
Reel/Frame 053644/0633 →
Assignment of Assignor's Interest Aug 31, 2020
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 053644/0918 →
Assignment of Assignor's Interest Aug 31, 2020
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 053645/0015 →
Assignment of Assignor's Interest Sep 24, 2020
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 053869/0549 →
Assignment of Assignor's Interest Nov 10, 2020
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 054321/0177 →
Assignment of Assignor's Interest Nov 10, 2020
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 054322/0525 →
Assignment of Assignor's Interest Dec 21, 2020
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC,
Reel/Frame 054707/0808 →
Assignment of Assignor's Interest Dec 21, 2020
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 054707/0840 →
Assignment of Assignor's Interest Dec 21, 2020
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 054706/0974 →
Assignment of Assignor's Interest Dec 21, 2020
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC,
Reel/Frame 054707/0558 →
Assignment of Assignor's Interest Dec 21, 2020
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 054707/0672 →
Assignment of Assignor's Interest Jan 27, 2021
From: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
To: JIANGSU NATA OPTO-ELECTRONIC MATERIALS CO. LTD.
Reel/Frame 055054/0570 →
Assignment of Assignor's Interest Jun 28, 2021
From: ZHOU, XIAOBING; REKKEN, BRIAN DAVID; KETOLA, BARRY M.
To: DOW CORING CORPORATION
Reel/Frame 056680/0325 →
Assignment of Assignor's Interest Jun 28, 2021
From: ZHOU, XIAOBING
To: DOW COMING CORPORATION
Reel/Frame 056680/0292 →