Patent Assignment
Reel/Frame 041568/0435
Assignment of Assignor's Interest
Recorded: 2017-03-14
Pages: 6
Assignors
MATSUMOTO, KAZUYO
Executed: 2017-03-13
KASAGI, YASUO
Executed: 2017-03-13
SHIMIZU, SATOSHI
Executed: 2017-03-13
OGAWA, HIROYUKI
Executed: 2017-03-13
MASAMORI, YOHEI
Executed: 2017-03-13
YU, JIXIN
Executed: 2017-03-10
ZHANG, TONG
Executed: 2017-03-10
KAI, JAMES
Executed: 2017-03-10
Assignee
SANDISK TECHNOLOGIES LLC
6900 NORTH DALLAS PARKWAY, SUITE 325, PLANO, TEXAS, 75024
Covered Properties
(3)
Bulb-Shaped Memory Stack Structures for Direct Source Contact in Three-Dimensional Memory Device
Bulb-Shaped Memory Stack Structures for Direct Source Contact in Three-Dimensional Memory Device
Application:
62/416,859 →
Buried Source Contact Layer for a Three-Dimensional Memory Device and Method of Making the Same
Application:
62/417,575 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 14, 2017
From: OGAWA, HIROYUKI; KASAGI, YASUO; SHIMIZU, SATOSHI; MATSUMOTO, KAZUYO
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 041570/0208 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →