IP Library › Assignment 041749/0146
Patent Assignment
Reel/Frame 041749/0146

Change of Name

Recorded: 2017-02-17 Pages: 2
Assignor
SANDISK TECHNOLOGIES, INC.
Executed: 2016-05-16
Assignee
SANDISK TECHNOLOGIES LLC
6900 DALLAS PARKWAY, SUITE 325, PLANO, TEXAS, 75024
Covered Properties (2)
Metal Line with Increased Inter-Metal Breakdown Voltage
Patent: 9,607,997 →
Application: 14/848,081 →
Publication: US 2017/0069638
Data Folding in 3D Nonvolatile Memory
Patent: 9,858,009 →
Application: 14/923,137 →
Publication: US 2017/0115884
Related Assignments (7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2015
From: YAMADA, KATSUO; TAKAHASHI, YUJI; FUKUO, NORITAKA; UOZAKI, MASAMI
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 036589/0101 →
Assignment of Assignor's Interest Oct 27, 2015
From: BHALERAO, ABHIJEET; KOCHAR, MRINAL; EA, DENNIS; PALITYKA, MIKHAIL
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 036890/0691 →
Change of Name May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038812/0954 →
Change of Name Feb 16, 2017
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 041738/0033 →
Assignment of Assignor's Interest Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →