IP Library › Assignment 041802/0304
Patent Assignment
Reel/Frame 041802/0304

Assignment of Assignor's Interest

Recorded: 2017-03-30 Pages: 6
Assignors
ODNOBLYUDOV, VLADIMIR
Executed: 2013-06-10
SCHUBERT, MARTIN F.
Executed: 2013-06-13
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707
Covered Property (1)
Ultrathin Solid State Dies and Methods of Manufacturing the Same
Application: 15/474,786 →
Publication: US 2017/0207366
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 4 to Patent Security Agreement May 4, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042405/0909 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050702/0451 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →