IP Library Assignment 041961/0875
Patent Assignment
Reel/Frame 041961/0875

Assignment of Assignor's Interest

Recorded: 2017-04-11 Pages: 5
Assignors
VICK, ERIC PAUL
Executed: 2016-10-27
TEMPLE, DOROTA
Executed: 2016-10-25
Assignee
RESEARCH TRIANGLE INSTITUTE
3040 CORNWALLIS ROAD, RESEARCH TRIANGLE PARK, NORTH CAROLINA, 27709
Covered Property (1)
Electronic Packages with Three-Dimensional Conductive Planes, and Methods for Fabrication
Patent: 9,881,905 →
Application: 15/304,858 →
Publication: US 2017/0207198
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 7, 2017
From: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
To: MIDCAP FINANCIAL TRUST
Reel/Frame 043476/0302 →
Release of Security Interest Aug 7, 2017
From: ALLY BANK
To: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
Reel/Frame 043479/0071 →
Release of Security Interest Feb 6, 2020
From: MIDCAP FINANCIAL TRUST
To: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
Reel/Frame 051834/0394 →
Security Agreement Feb 6, 2020
From: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC; SILICON TURNKEY SOLUTIONS, INC.
To: ALLY BANK, AS ASSIGNEE
Reel/Frame 051836/0697 →