Patent Assignment
Reel/Frame 042224/0710
Assignment of Assignor's Interest
Recorded: 2017-05-03
Pages: 7
Assignors
DHIR, SOURHABH
Executed: 2017-04-28
LI, ANDREW L.
Executed: 2017-05-02
TANG, SANH D.
Executed: 2017-05-01
KOBAYASHI, NAOYOSHI
Executed: 2017-04-25
KOGE, KATSUMI
Executed: 2017-05-01
Assignee
MICRON TECHNOLOGY, INC.
MS 1-525, 8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716
Covered Property
(1)
Structure Of Integrated Circuitry And A Method Of Forming A Conductive Via
Patent:
9,960,114 →
Application:
15/585,396 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 5 to Patent Security Agreement
Aug 8, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 043482/0776 →
Supplement No. 5 to Patent Security Agreement
Aug 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION
Reel/Frame 043483/0686 →
Release of Security Interest
Jul 20, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046597/0393 →
Release of Security Interest
Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050700/0535 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →