Patent Assignment
Reel/Frame 042308/0556
Assignment of Assignor's Interest
Recorded: 2017-05-09
Pages: 7
Assignors
LIAO, ALBERT
Executed: 2017-05-05
KINNEY, WAYNE I.
Executed: 2017-05-09
LEE, YI FANG
Executed: 2017-05-09
SIDDIK, MANZAR
Executed: 2017-05-05
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 525, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Semiconductor Structures, Memory Cells and Devices Comprising Ferroelectric Materials, Systems Including Same, and Related Methods
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 5 to Patent Security Agreement
Aug 8, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 043482/0776 →
Supplement No. 5 to Patent Security Agreement
Aug 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION
Reel/Frame 043483/0686 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Jul 20, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046597/0393 →
Release of Security Interest
Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050700/0535 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →