Patent Assignment
Reel/Frame 042458/0291
Assignment of Assignor's Interest
Recorded: 2017-05-22
Pages: 10
Assignors
FAROOQ, MUKTA G.
Executed: 2015-06-22
OAKLEY, JENNIFER A.
Executed: 2015-06-22
PETRARCA, KEVIN S.
Executed: 2015-06-22
REARDON, NICOLE R.
Executed: 2015-06-22
SIMON, ANDREW H.
Executed: 2015-06-24
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Insulating a via in a Semiconductor Substrate
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 21, 2025
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 073658/0439 →
Change of Name
Nov 21, 2025
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 073658/0823 →