IP Library › Assignment 042484/0116
Patent Assignment
Reel/Frame 042484/0116

Assignment of Assignor's Interest

Recorded: 2017-05-23 Pages: 6
Assignors
WIRZ, BRANDON P.
Executed: 2017-05-03
MCCLAIN, BENJAMIN L.
Executed: 2017-05-05
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX, BOISE, IDAHO, 83707-0006
Covered Property (1)
Semiconductor Device Assembly with Surface-Mount Die Support Structures
Application: 15/603,327 →
Publication: US 2018/0342476
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 5 to Patent Security Agreement Aug 8, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 043482/0776 →
Supplement No. 5 to Patent Security Agreement Aug 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION
Reel/Frame 043483/0686 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Jul 20, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046597/0393 →
Release of Security Interest Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050700/0535 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →