IP Library › Assignment 042612/0518
Patent Assignment
Reel/Frame 042612/0518

Entity Conversion

Recorded: 2017-05-30 Pages: 2
Assignor
SANDISK TECHNOLOGIES INC.
Executed: 2016-05-16
Assignee
SANDISK TECHNOLOGIES LLC
6900 DALLAS PARKWAY, SUITE 325, PLANO, TEXAS, 75024
Covered Property (1)
Vertical Resistor In 3D Memory Device With Two-Tier Stack
Patent: 9,941,297 →
Application: 15/607,837 →
Publication: US 2017/0263642
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 30, 2017
From: NISHIKAWA, MASATOSHI; FUNAYAMA, KOTA; MIWA, TORU; OGAWA, HIROYUKI
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 042527/0340 →
Assignment of Assignor's Interest Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →