Patent Assignment
Reel/Frame 042727/0748
Assignment of Assignor's Interest
Recorded: 2017-06-15
Pages: 3
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Multi-Chip Modules Formed Using Wafer-Level Processing of a Reconstitute Wafer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Aug 30, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 061357/0485 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073689/0954 →