IP Library › Assignment 073689/0954
Patent Assignment
Reel/Frame 073689/0954

Change of Name

Recorded: 2025-11-24 Pages: 5
Assignor
INVENSAS LLC
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (8)
Multi-Chip Modules Formed Using Wafer-Level Processing of a Reconstitute Wafer
Application: 15/624,494 →
Publication: US US20180366436A1
Multi-Chip Modules Formed Using Wafer-Level Processing of a Reconstituted Wafer
Application: 16/246,863 →
Publication: US US20190148339A1
Flat Metal Features for Microelectronics Applications
Application: 15/994,435 →
Publication: US US20180350674A1
Flat Metal Features for Microelectronics Applications
Application: 16/563,512 →
Publication: US US20190393086A1
Dielets on Flexible and Stretchable Packaging for Microelectronics
Application: 15/970,055 →
Dielets on Flexible and Stretchable Packaging for Microelectronics
Application: 16/515,417 →
Publication: US US20190341350A1
Diffused Bitline Replacement in Stacked Wafer Memory
Application: 16/369,631 →
Publication: US US20200312815A1
Mixed Exposure for Large Die
Application: 17/075,489 →
Related Assignments (11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 15, 2017
From: WANG, LIANG; KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 042727/0748 →
Assignment of Assignor's Interest May 3, 2018
From: HUANG, SHAOWU; DELACRUZ, JAVIER A.
To: INVENSAS CORPORATION
Reel/Frame 045706/0550 →
Assignment of Assignor's Interest May 31, 2018
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 045953/0862 →
Assignment of Assignor's Interest Jan 14, 2019
From: WANG, LIANG; KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 047988/0895 →
Assignment of Assignor's Interest May 17, 2019
From: MOREIN, STEPHEN
To: INVENSAS CORPORATION
Reel/Frame 049211/0401 →
Assignment of Assignor's Interest Jul 18, 2019
From: HUANG, SHAOWU; DELACRUZ, JAVIER A.
To: INVENSAS CORPORATION
Reel/Frame 049791/0489 →
Assignment of Assignor's Interest Sep 6, 2019
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 050298/0204 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Assignment of Assignor's Interest Oct 20, 2020
From: DELACRUZ, JAVIER A.; HABA, BELGACEM
To: INVENSAS CORPORATION
Reel/Frame 054114/0458 →
Change of Name Aug 30, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 061357/0485 →
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →