Patent Assignment
Reel/Frame 043066/0249
Assignment of Assignor's Interest
Recorded: 2017-07-21
Pages: 7
Assignors
CHIU, CHIN-TIEN
Executed: 2015-01-23
FU, PENG
Executed: 2014-10-23
LU, ZHONG
Executed: 2015-01-25
TAI, ENYONG
Executed: 2015-01-25
Assignee
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
NO. 388, JIANG CHUAN EAST ROAD, MINHANG DISTRICT, SHANGHAI, 200241, CHINA
Covered Property
(1)
Semiconductor Device Including Independent Film Layer for Embedding and/or Spacing Semiconductor Die
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 21, 2017
From: YE, NING; UPADHYAYULA, SURESH; YU, CHEEMAN; ZHANG, YUANG
To: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 043066/0352 →
Assignment of Assignor's Interest
Jan 10, 2024
From: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO. LTD.; SANDISK SEMICONDUCTOR (SHANGHAI) CO. LTD.
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 066087/0345 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →