Patent Assignment
Reel/Frame 066087/0345
Assignment of Assignor's Interest
Recorded: 2024-01-10
Pages: 6
Assignors
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO. LTD.
Executed: 2023-12-19
SANDISK SEMICONDUCTOR (SHANGHAI) CO. LTD.
Executed: 2023-12-19
Assignee
SANDISK TECHNOLOGIES LLC
5601 GREAT OAKS PKWY., LEGAL DEP., SAN JOSE, CALIFORNIA, 95119
Covered Property
(1)
Semiconductor Device Including Independent Film Layer for Embedding and/or Spacing Semiconductor Die
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 21, 2017
From: CHIU, CHIN-TIEN; FU, PENG; LU, ZHONG; TAI, ENYONG
To: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 043066/0249 →
Assignment of Assignor's Interest
Jul 21, 2017
From: YE, NING; UPADHYAYULA, SURESH; YU, CHEEMAN; ZHANG, YUANG
To: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 043066/0352 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →