Patent Assignment
Reel/Frame 043094/0084
Assignment of Assignor's Interest
Recorded: 2017-07-25
Pages: 4
Assignor
RESEARCH TRIANGLE INSTITUTE
Executed: 2000-10-26
Assignee
ZIPTRONIX, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(2)
Method for Low Temperature Bonding and Bonded Structure
Method for Low Temperature Bonding and Bonded Structure
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Change of Name
Jun 28, 2017
From: ZIPTRONIX , INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 043029/0657 →
Assignment of Assignor's Interest
Jul 25, 2017
From: TONG, QIN-YI; FOUNTAIN, GAIUS GILLMAN, JR.; ENQUIST, PAUL M.
To: RESEARCH TRIANGLE INSTITUTE
Reel/Frame 043094/0108 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →