Patent Assignment
Reel/Frame 043094/0108
Assignment of Assignor's Interest
Recorded: 2017-07-25
Pages: 3
Assignors
TONG, QIN-YI
Executed: 2000-03-06
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2000-03-09
ENQUIST, PAUL M.
Executed: 2000-03-06
Assignee
RESEARCH TRIANGLE INSTITUTE
3040 CORNWALLIS ROAD, RESEARCH TRIANGLE PARK, NORTH CAROLINA, 27709
Covered Properties
(2)
Method for Low Temperature Bonding and Bonded Structure
Method for Low Temperature Bonding and Bonded Structure
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Change of Name
Jun 28, 2017
From: ZIPTRONIX , INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 043029/0657 →
Assignment of Assignor's Interest
Jul 25, 2017
From: RESEARCH TRIANGLE INSTITUTE
To: ZIPTRONIX, INC.
Reel/Frame 043094/0084 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →