IP Library › Assignment 043102/0809
Patent Assignment
Reel/Frame 043102/0809

Assignment of Assignor's Interest

Recorded: 2017-07-26 Pages: 4
Assignor
KIM, HYOUNG IL
Executed: 2017-03-27
Assignee
INTEL COPRORATION
2200 MISSION COLLEGE BLVD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Multi-Package Integrated Circuit Assembly with Through-Mold Via
Application: 15/460,982 →
Publication: US 2018/0269187
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 043102 Frame: 0809. Assignor(S) Hereby Confirms the Assignment. Aug 14, 2017
From: KIM, HYOUNG IL
To: INTEL CORPORATION
Reel/Frame 043542/0965 →