Patent Assignment
Reel/Frame 043542/0965
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 043102 Frame: 0809. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2017-08-14
Pages: 4
Assignor
KIM, HYOUNG IL
Executed: 2017-03-27
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Multi-Package Integrated Circuit Assembly with Through-Mold Via
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.