IP Library › Assignment 043403/0308
Patent Assignment
Reel/Frame 043403/0308

Assignment of Assignor's Interest

Recorded: 2017-08-25 Pages: 5
Assignors
WUU, JOHN
Executed: 2017-08-23
NAFFZIGER, SAMUEL
Executed: 2017-08-24
Assignee
ADVANCED MICRO DEVICES, INC.
ONE AMD PLACE, PO BOX 3453, KEVIN A. O'NEIL, SUNNYVALE, CALIFORNIA, 94088-3453
Covered Property (1)
Arrangement and Thermal Management of 3D Stacked Dies
Application: 15/686,558 →
Publication: US 2019/0067152
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 25, 2017
From: MYSORE, KAUSHIK; WILKERSON, BRETT P.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 043403/0355 →
Assignment of Assignor's Interest Aug 25, 2017
From: BHAGAVAT, MILIND S.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 043403/0396 →
Assignment of Assignor's Interest Oct 2, 2017
From: SHYVERS, PATRICK J.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 043754/0689 →