Patent Assignment
Reel/Frame 043403/0355
Assignment of Assignor's Interest
Recorded: 2017-08-25
Pages: 9
Assignee
ADVANCED MICRO DEVICES, INC.
ONE AMD PLACE, PO BOX 3453, KEVIN A. O'NEIL, SUNNYVALE, CALIFORNIA, 94088-3453
Covered Property
(1)
Arrangement and Thermal Management of 3D Stacked Dies
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 25, 2017
From: WUU, JOHN; NAFFZIGER, SAMUEL
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 043403/0308 →
Assignment of Assignor's Interest
Aug 25, 2017
From: BHAGAVAT, MILIND S.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 043403/0396 →
Assignment of Assignor's Interest
Oct 2, 2017
From: SHYVERS, PATRICK J.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 043754/0689 →