IP Library › Assignment 043634/0098
Patent Assignment
Reel/Frame 043634/0098

Assignment of Assignor's Interest

Recorded: 2017-08-22 Pages: 9
Assignors
KIM, DONG JIN
Executed: 2015-09-11
KIM, JIN HAN
Executed: 2015-09-24
CHA, SE WOONG
Executed: 2015-10-26
LEE, JI HUN
Executed: 2015-09-21
KIM, JOON DONG
Executed: 2015-09-21
KO, YEONG BEOM
Executed: 2015-09-21
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Method of Manufacturing a Package-on-Package Type Semiconductor Package
Application: 15/683,065 →
Publication: US 2017/0373051
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →