IP Library › Assignment 043636/0862
Patent Assignment
Reel/Frame 043636/0862

Assignment of Assignor's Interest

Recorded: 2017-08-22 Pages: 5
Assignors
BALOGLU, BORA
Executed: 2015-11-10
ZWENGER, CURTIS
Executed: 2015-11-16
HUEMOELLER, RON
Executed: 2015-11-12
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Encapsulated Semiconductor Package and Method of Manufacturing Thereof
Application: 15/683,328 →
Publication: US 2018/0082896
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →